Restriction of Hazardous Substances (RoHS)
RoHS Compliance means conformity to Directive 2011/65/EU of the European Parliament and the Council of 8 June 2011 and to the amended Annex in Directive (EU) 2015/863 of 31 March 2015, on the restriction of the use of certain hazardous substances in electrical and electronic equipment. It restricts the use of the following substances: lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ether, bis (2-ethyhexyl) phthalate (DEHP), butyl benzyl phthalate (BBP), dibutyl phthalate (DBP) and diisobutyl phthalate (DIBP). The maximum permitted concentrations are 0.1% or 1000 ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material. VPG defines homogeneous material as materials that cannot be mechanically disjointed into different materials. Examples of homogeneous materials are electroplated coatings, molding compounds, insulation sleeves, lead frame alloys, and bonding wires.
On July 22, 2019 restrictions came into force for 4 phthalates – bis(2-ethylhexyl) phthalate (DEHP), butyl benzyl phthalate (BBP), dibutyl phthalate (DBP) and diisobutyl phthalate (DIBP) to the list of restricted substances in Annex II to Directive 2011/65/EU. There is a grace period for Category 8- Medical Devices and Category 9- Monitoring and Control, including Industrial Monitoring and Control Equipment until July 22, 2021 (two years). The change also adds a new Category 11- Other Electrical and Electronic Equipment Not Covered by any other category that includes electrical cables that are less than 250V.
Vishay Precision Group (VPG) recognizes the environmental concerns caused by lead and has started the process of eliminating or reducing the lead content of VPG products.
Electronics companies in Japan and lawmakers in Europe have established goals for the elimination of lead from electronic products in their regions. The United States has not issued specific legislation to eliminate lead at this time. VPG intends to meet all legislative mandates within the time frames expected by our customer base.
The majority of all VPG's products have lead-free terminations and we expect 100% of required products to have lead-free terminations in the near future.
Frequently Asked Questions
Q. What is VPG's definition of lead-free plating/finish?
A. There is no intentionally added lead (<1000 ppm as per the JEDEC standard) in the plating/finish.
Q. Are components with lead-free termination finish available now?
A. The majority of VPG's products are available with lead-free finishes today. To order these parts please contact your local Sales Office.
Q. What lead-free finishes are currently used by VPG?
A. There are several types of lead-free finishes used by VPG. The majority of the finishes are the industry standard of 100% tin.
Q. How can customers identify lead-free and RoHS products?
A. VPG complies with JEDEC Standard 97 to identify the Pb-termination status of its products. In addition, VPG also applies the words "RoHS" to reels, ammo packs, shipping boxes, and so forth, that meet Directive 2011/65/EU of the European Parliament and the Council of 8 June 2011.
Q. Will VPG change part numbers for components with lead-free finishes?
A. Yes, VPG will add another sign to the current part number to distinguish between the two production lines. Parts that have been lead-free for several years will maintain their current part numbers
Q. Are lead-free components compatible with lead soldering temperatures?
A. The majority of VPG components are backward compatible to 215°C.
Q. What tests have been done to qualify lead-free finishes?
A. Moisture Sensitivity (if applicable), Solderability, Resistance to Soldering Heat and Whisker Growth are the minimum tests performed to qualify lead-free finishes. Moisture Sensitivity is performed according to J-STD-020B/C or greater. Solderability is performed at 215°C and <10s for SMDs and 235°C/2s for through-hole products according to IEC 60068-2, IPC J-STD-002B, and EIA/JESD22-B102. These test conditions are used to test backward compatibility. VPG has standardized whisker testing requirements and those tests are summarized in the Whisker Testing section below.
Q. Which solder profile is recommended for components with lead-free finishes?
A. Our goal is to meet the industry standard for reflow, which is mostly defined in IPC/JEDEC J-STD-020 /C or greater which requires a maximum peak of 260°C depending on the component volume.